Lighting device and lighting system having the same

ABSTRACT

Provided are a lighting device and a lighting system having the same. The lighting device includes a board having a recess, a lead frame disposed in the recess and including a first lead frame protrusion protruding upward, and a light emitting device disposed on the lead frame.

The present application claims priority under 35 U.S.C. 119 to KoreanPatent Application No. 10-2010-0029941 filed Apr. 1, 2010, which ishereby incorporated by reference in its entirety.

BACKGROUND

Embodiments relate to a lighting device and a lighting system having thesame.

Light emitting diodes (LED) are semiconductor devices that can realizelight sources having various colors using GaAs-based, AlGaAs-based,GaN-based, InGaN-based, and AlGaInP-based compound semiconductormaterials.

Characteristics of such an LED may be determined according to compoundsemiconductor materials used in the LED, colors, brightness, intensitiesof brightness, etc. Also, the LED is packaged and is being used as alight source in various fields, for example, on/off indicatorsdisplaying colors, character display devices, image display devices,etc.

SUMMARY

Embodiments provide a lighting device having an improved heatdissipation characteristic using a lead frame and a lighting systemhaving the same.

Embodiments also provide a lighting device in which at least one frameof lead frames protrudes inside a board to effectively dissipate heatgenerated in a light emitting device and a lighting system having thesame.

Embodiments also provide a lighting device in which at least one frameof lead frames protrudes toward a recess or a resin material toeffectively dissipate heat generated in a light emitting device and alighting system having the same.

In one embodiment, a lighting device comprises: a board having a recess;a lead frame disposed in the recess and comprising a first lead frameprotrusion protruding upward; and a light emitting device disposed onthe lead frame.

In another embodiment, a lighting device comprises: a board; a lightemitting device disposed on the board; and a lead frame electricallyconnected to the light emitting device, wherein the lead frame comprisesa first lead frame protrusion protruding upward and a second lead frameprotrusion, in which a portion thereof is inserted into the board,exposed to the outside of the board to extend downward.

In further another embodiment, a lighting system comprises: a case; alight emitting module disposed in the case and comprising at least onelighting device; and a connection terminal disposed in the case andreceiving a power from an external power source, wherein the lightingdevice comprises a board having a recess; a lead frame disposed in therecess and comprising a first lead frame protrusion protruding upward;and a light emitting device disposed on the lead frame.

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below. Other features will be apparent fromthe description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view of a lighting device according to a first embodiment.

FIG. 2 is a sectional view of the lighting device of FIG. 1.

FIG. 3 is an enlarged view illustrating portions of a lead frame and aboard illustrated in FIG. 2.

FIG. 4 is a view of a lighting device according to a second embodiment.

FIG. 5 is a sectional view of the lighting device of FIG. 4.

FIG. 6 is a perspective view of a lead frame illustrated in FIGS. 4 and5.

FIG. 7 is a sectional view of a lighting device according to a thirdembodiment.

FIG. 8 is a perspective view of a lead frame of FIG. 7.

FIG. 9 is a view of a display device according to an embodiment.

FIG. 10 is a view illustrating another example of the display deviceaccording to an embodiment.

FIG. 11 is a view of a lighting system according to another embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the descriptions of embodiments, it will be understood that when alayer (or film), a region, a pattern, or a structure is referred to asbeing ‘on’ a layer (or film), a region, a pad, or patterns, it can bedirectly on another layer, or intervening layers may also be present.Further, it will be understood that when a layer is referred to as being‘under’ another layer, it can be directly under another layer, and oneor more intervening layers may also be present. Further, the referenceabout ‘on’ and ‘under’ each layer will be made on the basis of drawings.

In the drawings, the thickness or size of each layer is exaggerated,omitted, or schematically illustrated for convenience in description andclarity. Also, the size of each element does not entirely reflect anactual size.

Hereinafter, exemplary embodiments will be described with reference tothe accompanying drawings.

FIG. 1 is a view of a lighting device according to a first embodiment.FIG. 2 is a sectional view of the lighting device along an X-axis ofFIG. 1. FIG. 3 is an enlarged view illustrating portions of a lead frameand a board illustrated in FIG. 2.

A lighting device 100 may be classified into a lateral type lightingdevice and a vertical type lighting device. The lighting device 100 mayhave various shapes such as a rectangular parallelepiped shape and acube shape. The lighting device 100 can be used as light unit forbacklight of liquid crystal display device and lighting system, etc.Hereinafter, for convenience of description, the lateral type lightingdevice will be described as an example.

The lighting device 100 comprises a board 110 having a recess 120, leadframes 133 and 143, and a light emitting device 150.

The board 110 may be formed of one of poly phthal amide (PPA), polyamide 9T (PA9T), liquid crystal polymer (LCP), and syndiotacticpolystyrene (SPS). Also, the board 110 may be a printed circuit board(PCB).

The board 110 has the recess 120 having a predetermined depth on a topsurface thereof. However, according to another embodiment, the recess120 may not be defined.

Here, a first direction of the board 110 is referred to as an X-axisdirection, and a second direction of the board 110 is referred to as aY-axis direction. A length of the board 110 in the x-axis direction maybe greater than a width of the board 110 in the Y-axis direction.However, the present disclosure is not limited to the shape of the board110.

The lead frames 133 and 143 may be formed on a top surface of the board110 through injection molding. The lead frames 133 and 143 may bedisposed within the board 110. Portions of the lead frames 133 and 143may be exposed from the recess 120.

As shown in FIG. 2, the lead frames 133 and 143 may comprise lead frameprotrusions 134 and 144 protruding toward the inside (Z-axis downwarddirection) of the board 110, respectively. That is, the lead frameprotrusions 134 and 144 for increasing heat dissipation areas of thelead frames 133 and 143 formed of a metal material are disposed toimprove dissipation of heat generated from the light emitting device150.

As shown in FIG. 3, each of the lead frame protrusions 134 and 144 maybe disposed in consideration of a distance spaced from the board 110.That is, the first lead frame protrusion 134 of the lead frameprotrusions 134 and 144 may be disposed to maintain a predetermineddistance or more from a side part 111 and/or a bottom part 112 of theboard 110.

For example, the first lead frame protrusion 134 may be spaced from theside part 111 and the bottom part 112 of the board 110 by a distance ofabout 50 μm to about 100 μm. When the distance is less than about 50 μm,moisture may be permeated into the lead frames 133 and 143 from theoutside (specifically, from a downward direction).

If it is assumed that a distance between the first lead frame protrusion134 and the side part 111 of the board 110 is referred to as a referencesymbol A and a distance between the first lead frame protrusion 134 andthe bottom part 112 of the board 110 is referred to as a referencesymbol B, each of the reference symbols A and B being greater than about50 μm may be useful.

The lead frames 133 and 143 and the lead frame protrusions 134 and 144may be formed of the same metal material as each other. For example, thelead frames 133 and 143 and the lead frame protrusions 134 and 144 maybe formed of one of metals such as Fe, Sn, Cr, Zn, Ni, Al, Ag, Au, Cu,and combinations thereof.

Left/right side surfaces 131 in the X-axis direction and top/bottomsurfaces 132 of the recess 120 may constitute a portion of the board110. Also, each of the left/right side surfaces 131 and top/bottomsurfaces 132 of the recess 120 may be inclined at a predetermined angle.In this case, the inclined shape may be illustrated as shown in FIG. 1.

The light emitting device 150 may be provided on the lead frames 133 and143 disposed in the recess 120 and connected to the lead frames 133 and143 using wires 152. Also, the light emitting device 150 may be providedon the plurality of lead frames 133 and 143 through wire bonding, flipbonding, or die bonding. The light emitting device 150 may be disposedon the board 110 and electrically connected to the lead frames 133 and143.

Also, the light emitting device 150 may comprise at least one or moreLED chips of AlGaN-based, GaN-based, InGaAlP-based, GaAs-based LED chipsformed of a group III-V element compound semiconductor. Also, aprotection device such as a Zener diode may be provided to protect thelight emitting device 150.

The lighting device 100 may be realized by a blue LED chip and a whitelight emitting device using a yellow phosphor (e.g., a silicate-basedphosphor), an orange phosphor, a green phosphor, and a red phosphoraccording to its realization configuration. Also, the lighting device100 may be realized as a light source by at least one or morecombinations of a red LED chip, a green LED chip, a blue LED chip, ayellow LED chip, a yellow green LED chip, and an UV LED chip.

A resin material may be molded in the recess 120 to protect the lightemitting device 150. The resin material may be formed using transparentepoxy or silicone. Alternatively, as necessary, a resin materialcontaining phosphor powder may be molded in the recess 120. Moldingsolution or additives may be selectively used as the resin materialaccording to purposes for use, use environment, and characteristics ofproducts. Also, a surface of the resin material may have one shape of aflat shape, a concave lens shape, and a convex lens shape.

FIG. 4 is a view of a light emitting device according to a secondembodiment. FIG. 5 is a sectional view of the lighting device along theX-axis of FIG. 4. FIG. 6 is a perspective view of a lead frameillustrated in FIGS. 4 and 5. The descriptions of the same components asthose of the first embodiment will be omitted.

A lighting device 100 according to a second embodiment comprises a board110 having a recess 120, lead frames 133 and 143, and a light emittingdevice 150. The board 110 may be formed of one of poly phthal amide(PPA), poly amide 9T (PA9T), liquid crystal polymer (LCP), andsyndiotactic polystyrene (SPS). Also, the board 110 may be a PCB.

As shown in FIG. 5, the lead frames 133 and 143 according to the secondembodiment comprise lead frame protrusions 234 and 244 protruding towardthe recess 120 (Z-axis upward direction), respectively. That is, thelead frame protrusions 234 and 244 for increasing heat dissipation areasof the lead frames 133 and 143 formed of a metal material are disposedto improve dissipation of heat generated from the light emitting device150. As shown in FIG. 4, the lead frame protrusions 234 and 244 arearranged around the recess 120 of the board 110. The lead frames 133 and143 may be disposed within the board 110.

As shown in FIG. 6, the lead frame protrusions 234 and 244 may comprisea plurality of protrusions. Also, the lead frame protrusions 234 and 244may be inclined at a predetermined angle, but vertically protrude fromthe lead frames 133 and 143 so that the lead frame protrusions 234 and244 may be disposed along an inclined surface of the recess 120 of theboard 110.

In FIG. 6, the first lead frame protrusion 234 protruding upward fromthe first lead frame 133 and the second lead frame protrusion 244protruding upward from the second lead frame 143 may be provided. Thatis, for example, six first lead frame protrusions 234 and four secondlead frame protrusions 244 are illustrated in FIG. 6.

However, the number and configuration of the lead frame protrusions areonly an example. According to a modified embodiment, a protrusion havinga trunk shape as that of the first embodiment may protrude upward fromthe lead frame, and also, the number of protrusions may be variouslychanged. Also, as described in the first embodiment, a protrusion havinga trunk shape may be further disposed under the lead frame.

As shown in FIG. 4, the lead frame protrusions 234 and 244 may bedisposed outside a region of the recess 120 of the board 110. Accordingto a modified embodiment, the lead frame protrusions 234 and 244 may bedisposed along an inclined surface within the recess 120.

The lead frames 133 and 143 and the lead frame protrusions 234 and 244may be formed of the same metal material as each other. As describedabove, the lead frames 133 and 143 and the lead frame protrusions 234and 244 may be formed of one of metals such as Fe, Sn, Cr, Zn, Ni, Al,Ag, Au, Cu, and combinations thereof. Also, the lead frames 133 and 143and the lead frame protrusions 234 and 244 may be formed together withthe recess 120 when the board 110 is formed.

FIG. 7 is a sectional view of a light emitting device according to athird embodiment, and FIG. 8 is a perspective view of a lead frame ofFIG. 7. The descriptions of the same components as those of the firstand second embodiments will be omitted.

As shown in FIGS. 7 and 8, in a lighting device according to a thirdembodiment, lead frames 133 and 143 may comprise protrusions,respectively. The lead frame protrusions extending and protruding fromthe lead frames 133 and 143 comprise protrusions protruding upward andprotrusions protruding downward.

That is, the protrusions extending from the lead frames 133 and 143 maycomprise first lead frame protrusions 334 and 344 protruding from thelead frames 133 and 143 in a direction (a Z-axis upward direction) of arecess 120 of a board 110 and second lead frame protrusions 335 and 345protruding from the lead frames 133 and 143 in an inner direction (aZ-axis downward direction) of the board 110. Here, since the first leadframe protrusions 334 and 344 protrude upward with respect to the board110, the first lead frame protrusions may be referred to as lead frameupper protrusions. Also, since the second lead frame protrusions 335 and345 protrude downward with respect to the board 110, the second leadframe protrusions 335 and 345 may be referred to as lead frame lowerprotrusions.

Hereinafter, for better comprehension, the first lead frame protrusionswill be referred to as the lead frame upper protrusions, and the secondlead frame protrusions will be referred to as the lead frame lowerprotrusions.

Like the second embodiment, the lead frame upper protrusions 334 and 344may comprise a plurality of protrusions. The plurality of protrusionsmay be arranged around the outside of the recess 120, which is inclinedat a predetermined angle.

Each of the lead frame lower protrusions 335 and 345 has an L-shape.Also, a portion of each of the lead frame lower protrusions 335 and 345may be disposed within the board 110. To increase heat dissipation area,each of the lead frame lower protrusions 335 and 345 may have a trunkshape, like the first embodiment.

In the lead frame protrusions according to the third embodiment, sinceheat generated in the light emitting device 150 may be dissipated inupward and downward directions, a heat dissipation characteristic can befurther improved.

The lead frames 133 and 143 and the lead frame protrusions 334, 344,335, and 345 may be integrally formed using the same metal material. Asdescribed above, the lead frames 133 and 143 and the lead frameprotrusions 334, 344, 335, and 345 may be formed of one of metals suchas Fe, Sn, Cr, Zn, Ni, Al, Ag, Au, Cu, and combinations thereof.

The lighting device according to the foregoing embodiments may bevariously applicable to a display device, a light unit, and a lightingsystem.

FIG. 9 is an exploded perspective view of a display device according toan embodiment.

Referring to FIG. 9, a display device 1000 according to an embodimentmay comprise a light guide plate 1041, a light emitting module 1031providing light to the light guide plate 1041, a reflective member 1022under the light guide plate 1041, an optical sheet 1051 on the lightguide plate 1041, a display panel 1061 on the optical sheet 1051, and abottom cover 1011 receiving the light guide plate 1031, the lightemitting module 1031, and the reflective member 1022, but is not limitedthereto.

The bottom cover 1011, the reflective member 1022, the light emittingmodule 1031, the light guide plate 1041, and the optical sheet 1051 maybe defined as the light unit 1050.

The light guide plate 1041 diffuses light to produce planar light. Thelight guide plate 1041 may be formed of a transparent material. Forexample, the light guide plate 1041 may be formed of one of an acrylicresin-based material such as polymethylmethacrylate (PMMA), apolyethylene terephthalate (PET) resin, a poly carbonate (PC) resin, acyclic olefin copolymer (COC) resin, and a polyethylene naphthalate(PEN) resin.

The light emitting module 1031 provides light to at least one sidesurface of the light guide plate 1041. Thus, the light emitting module1031 may be used as a light source of the display device.

At least one light emitting module 1031 may be disposed on one sidesurface of the light guide plate 1041 to directly or indirectly providelight. The light emitting module 1031 may comprise a board 1033 and thelighting devices 100 according to the foregoing embodiments. Thelighting devices 100 may be arrayed with a predetermined distance on theboard 1033. That is, the lighting devices 100 may be arrayed on theboard 1033 in a chip or package form.

The board 1033 may be a printed circuit board (PCB) comprising a circuitpattern. Alternatively, the board 1033 may comprise at least one of ageneral PCB, a metal core PCB, and a flexible PCB, but is not limitedthereto. The lighting devices 100 may be provided on a side surface ofthe bottom cover 1011 or on a heatsink plate, the board 1033 may beremoved. Here, a portion of the heatsink plate may contact a top surfaceof the bottom cover 1011.

The plurality of lighting devices 100 may be provided on the board 1033so that a light emitting surface through which light is emitted isspaced a predetermined distance from the light guide plate 1041, but isnot limited thereto. A light emitting device package 200 may directly orindirectly provide light to a light incident surface that is one sidesurface of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate1041. Since the reflective member 1022 reflects light incident onto anunder surface of the light guide plate 1041 to upwardly supply thereflected light, brightness of the light unit 1050 can be improved. Forexample, the reflective member 1022 may be formed of one of PET, PC, andPVC, but is not limited thereto. The reflective member 1022 may be thetop surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the lightemitting module 1031, and the reflective member 1022. For this, thebottom cover 1011 may comprise a receiving part 1012 having a box shapewith an opened upper side, but is not limited thereto. The bottom cover1011 may be coupled to a top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resinmaterial. Also, the bottom cover 1011 may be manufactured using a pressmolding process or an extrusion molding process. The bottom cover 1011may be formed of a metal or non-metal material having superior heatconductivity, but is not limited thereto.

For example, the display panel 1061 may be a liquid crystal display(LCD) panel and comprise first and second boards formed of a transparentmaterial and a liquid crystal layer between the first and second boards.A polarizing plate may be attached to at least one surface of thedisplay panel 1061. The present disclosure is not limited to theattached structure of the polarizing plate. The display panel 1061transmits or blocks light provided from the light emitting module 1031to display information. The display device 1000 may be applied tovarious portable terminals, monitors for notebook computers, monitorsfor laptop computers, televisions, etc.

The optical sheet 1051 may be disposed between the display panel 1061and the light guide plate 1041 and comprise at least one transmissionsheet. For example, the optical sheet 1051 may comprise at least one ofa diffusion sheet, a horizontal or vertical prism sheet, a brightnessenhanced sheet, etc. The diffusion sheet diffuses incident light, andthe horizontal or/and vertical prism sheet collects the incident lightinto a display region. In addition, the brightness enhanced sheet reuseslost light to improve the brightness. Also, a protection sheet may bedisposed on the display panel 1061, but is not limited thereto.

Here, optical members such as the light guide plate 1041 and the opticalsheet 1051 may be disposed on an optical path of the light emittingmodule 1031, but is not limited thereto.

FIG. 10 is a view illustrating another example of the display deviceaccording to an embodiment. A lighting device disclosed in FIG. 10 mayhave a structure in which light emitting devices are arrayed in a chipor package form.

Referring to FIG. 10, a display device 1100 comprises a bottom cover1152, a board 1120 on which the above-described lighting devices 100 arearrayed, an optical member 1154, and a display panel 1155.

The board 1120 and the lighting devices 100 may be defined as a lightemitting module 1060. The bottom cover 1152, at least one light emittingmodule 1060, and the optical member 1154 may be defined as a light unit.The light emitting devices may be arrayed on the board 1129 in a chip orpackage form.

The bottom cover 1152 may comprise a receiving part 1153, but is notlimited thereto.

Here, the optical member 1154 may comprise at least one of a lens, alight guide plate, a diffusion sheet, horizontal and vertical prismsheets, and a bright enhancement sheet. The light guide plate may beformed of a PC material or a PMMA material. In this case, the lightguide plate may be removed. The diffusion sheet diffuses incident light,and the horizontal and vertical prism sheets concentrate the incidentlight into a display region. The brightness enhanced sheet reuses lostlight to improve brightness.

FIG. 11 is a view of a lighting system according to an embodiment.

Referring to FIG. 11, a lighting system 1500 may comprise a case 1510, alight emitting module 1530 disposed in the case 1510, and a connectionterminal 1520 disposed in the case 1510 to receive an electric powerfrom an external power source.

The case 1510 may be formed of a material having a good heat dissipationcharacteristic, for example, a metal material or a resin material.

The light emitting module 1530 may comprise a board 1532 and a lightingdevice 200 provided on the board 1532. The lighting device 200 may beprovided in plurality, and the plurality of lighting device 200 may bearrayed in a matrix shape or spaced a predetermined distance from eachother. Also, light emitting devices may be arrayed on the board 1532 ina chip or package form.

The board 1532 may be an insulator on which a circuit pattern isprinted. For example, the board 1532 may comprise one of a generalprinted circuit board (PCB), a metal core PCB, a flexible PCB, and aceramic PCB, etc.

Also, the board 1532 may be formed of a material, which efficientlyreflects light. Alternatively, a surface of the board 1532 may be alayer coated with a color, which efficiently reflects light, forexample, a white color or a silver color.

At least one lighting device 200 may be provided on the board 1532. Eachof the lighting devices 200 may comprise at least one light emittingdiode (LED) chip. The LED chip may comprise a color LED emitting red,green, blue or white light, and a UV LED emitting ultraviolet (UV) rays.

The light emitting module 1530 may have combinations of various lightingdevices 200 to obtain desired color and luminance. For example, thelight emitting module 1530 may have combinations of a white LED, a redLED, and a green LED to obtain a high color rendering index (CRI).

The connection terminal 1520 may be electrically connected to the lightemitting module 1530 to supply a power. The connection terminal 1520 maybe screw-fitted into and coupled to an external power source in a sockettype, but is not limited thereto. For example, the connection terminal1520 may be made in a pin type and inserted into the external powersource, or may be connected to the external power source through a wire.

In the lighting device and the lighting system having the same accordingto the embodiments, heat generated in the light emitting device may beeffectively dissipated.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A lighting device comprising: a board having afirst recess and a second recess; a lead frame comprising a first leadframe and a second lead frame electrically disconnected from the firstlead frame; and a light emitting device disposed on the lead frame,wherein the lead frame further comprises: a first lead frame protrusiondownwardly protruding from a bottom surface of the first lead frame anddisposed in the first recess, the first lead frame protrusion extendingunder the light emitting device; a second lead frame protrusiondownwardly protruding from a bottom surface of the second lead frame anddisposed in the second recess; and a third lead frame protrusionupwardly protruding from one of the first lead frame and the second leadframe, wherein the board comprises a third recess on a top surfacethereof, the third recess having a predetermined depth, wherein thethird recess exposes a top surface of the first lead frame and a topsurface of the second lead frame, and wherein the third lead frameprotrusion protrudes toward the third recess.
 2. The lighting device ofclaim 1, wherein the third lead frame protrusion is disposed along acircumference of an inner inclined surface of the third recess.
 3. Thelighting device of claim 1, wherein the third lead frame protrusioncomprises a plurality of protrusions including a first protrusion and asecond protrusion, the first protrusion extending upwardly from a firstside of the first lead frame and the second protrusion extendingupwardly from a second side of the first lead frame, the firstprotrusion and the second protrusion facing each other.
 4. The lightingdevice of claim 1, wherein each of the first lead protrusion and thesecond lead frame protrusion has side and bottom surfaces surrounded bythe board.
 5. The lighting device of claim 1, wherein the lead frame isdisposed within the board.
 6. The lighting device of claim 1, whereineach of the first lead frame protrusion and the second lead frameprotrusion is spaced apart from a side surface of the board and a bottomsurface of the board by a distance of about 50 μm to about 100 μm. 7.The lighting device of claim 1, wherein the first lead frame protrusion,the second lead frame protrusion, and the third lead frame protrusionare formed of the same material.
 8. The lighting device of claim 1,wherein the first recess is spaced apart from the second recess, andwherein the board includes a first portion under the first lead frameprotrusion, a second portion under the second lead frame protrusion, anda third portion between the first portion and the second portion, thethird portion having a thickness greater than a thickness of the firstportion.
 9. A lighting device comprising: a board; a light emittingdevice disposed on the board; and a lead frame electrically connected tothe light emitting device, wherein the lead frame comprises a baseframe, a first lead frame protrusion protruding upward from the baseframe, and a second lead frame protrusion protruding downward from thebase frame, wherein the second lead frame protrusion includes a firstportion exposed to the outside of the board and extending downward fromthe base frame and a second portion connected to the first portion andinserted into the board, a bottom surface of the second portion disposedunder the base frame and being parallel to a bottom surface of the baseframe, wherein each of the first portion and the second portion has athickness greater than a thickness of the base frame, wherein the boardcomprises a recess on a top surface thereof, the recess having apredetermined depth, wherein the recess exposes a top surface of thefirst lead frame and a top surface of the second lead frame, and whereinthe first lead frame protrusion protrudes toward the recess.
 10. Thelighting device of claim 9, wherein the first lead frame protrusioncomprises a plurality of protrusions extending upward from the leadframe.
 11. The lighting device of claim 9, wherein the second lead frameprotrusion has an L-shape.
 12. The lighting device of claim 9, whereinthe first lead frame protrusion and the second lead frame protrusion areformed of the same material.
 13. A lighting system comprising: a case; alight emitting module disposed in the case, the light emitting modulecomprising at least one lighting device; and a connection terminaldisposed in the case and receiving a power from an external powersource, the lighting device further comprising: a board having a firstrecess and a second recess; a lead frame comprising a first lead frame;a second lead frame electrically disconnected from the first lead frame;and a light emitting device disposed on the lead frame, wherein the leadframe further comprises: a first lead frame protrusion downwardlyprotruding from a bottom surface of the first lead frame and disposed inthe first recess, the first lead frame protrusion extending under thelight emitting device; a second lead frame protrusion downwardlyprotruding from a bottom surface of the second lead frame and disposedin the second recess; and a third lead frame protrusion upwardlyprotruding from one of the first lead frame and the second lead frame,wherein the board comprises a third recess on a top surface thereof, thethird recess having a predetermined depth, wherein the third recessexposes a top surface of the first lead frame and a top surface of thesecond lead frame, and wherein the third lead frame protrusion protrudestoward the third recess.
 14. The lighting system of claim 13, whereinthe third lead frame protrusion is disposed along a circumference of aninner inclined surface of the third recess.
 15. The lighting system ofclaim 13, wherein the third lead frame protrusion comprises a pluralityof protrusions including a first protrusion and a second protrusion, thefirst protrusion extending upwardly from a first side of the first leadframe and the second protrusion extending upwardly from a second side ofthe first lead frame, the first protrusion and the second protrusionfacing each other.
 16. The lighting system of claim 13, wherein the leadframe is disposed within the board.
 17. The lighting system of claim 13,wherein each of the first lead frame protrusion and the second leadframe protrusion has side and bottom surfaces surrounded by the board.18. The lighting system of claim 13, wherein each of the first leadframe protrusion and the second lead frame protrusion is spaced apartfrom a side surface of the board and a bottom surface of the board by adistance of about 50 μm to about 100 μm.
 19. The lighting system ofclaim 13, wherein the first lead frame protrusion, the second lead frameprotrusion, and the third lead frame protrusion are formed of the samematerial.
 20. The lighting system of claim 13, wherein the first recessis spaced apart from the second recess, and wherein the board includes afirst portion under the first lead frame protrusion, a second portionunder the second lead frame protrusion, and a third portion between thefirst portion and the second portion, the third portion having athickness greater than a thickness of the first portion.